GSNL453232 (1812)

GSNL453232 (1812)

High resistance to heat and humidity.(高抗熱及濕度) Resistant to mechanical shocks and pressures. (對於機械衝擊或壓力有良好之扺抗力)
GSNL453232 (1812)

GSNL322522 (1210)

High resistance to heat and humidity.(高抗熱及濕度) Resistant to mechanical shocks and pressures. (對於機械衝擊或壓力有良好之扺抗力)
GSMB853025

GSMB853025

Decreased DCR resistance (低直流阻抗) Increased current capacity (具有高電流值)
GSMB853025

GSMB403025

Decreased DCR resistance (低直流阻抗) Increased current capacity (具有高電流值)
GSMB853025

GSMB323023

Decreased DCR resistance (低直流阻抗) Increased current capacity (具有高電流值)
GSMB321611 (1206)

GSMB321611 (1206)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)