GSMB201209 (0805)

GSMB201209 (0805)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)
GSMB201209 (0805)

GSMB160808 (0603)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)
GSMB201209 (0805)

GSMB100505 (0402)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)
GSMA321611 (1206)

GSMA321611 (1206)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)High current to 3A.(大電流達3A)
GSMA321611 (1206)

GSMA201209 (0805)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)High current to 3A.(大電流達3A)
GSMA321611 (1206)

GSMA160808 (0603)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封閉磁路結構,可高密度安裝並避免干擾)Excellent solderability and heat resistance.(良好的焊錫性及耐熱性)High current to 3A.(大電流達3A)