GSMB201209 (0805)

GSMB201209 (0805)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)
GSMB201209 (0805)

GSMB160808 (0603)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)
GSMB201209 (0805)

GSMB100505 (0402)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)
GSMA321611 (1206)

GSMA321611 (1206)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)High current to 3A.(大电流达3A)
GSMA321611 (1206)

GSMA201209 (0805)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)High current to 3A.(大电流达3A)
GSMA321611 (1206)

GSMA160808 (0603)

Closed magnetic circuit structure allows high density mounting while preventing crosstalk.(封闭磁路结构,可高密度安装并避免干扰)Excellent solderability and heat resistance.(良好的焊锡性及耐热性)High current to 3A.(大电流达3A)